| PART |
Description |
Maker |
| MC-7883 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| MC-7881 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| TH50VSF4682AASB TH50VSF4683AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| CFY35 Q62702-F1394 CFY35-20 CFY35-23 Q62702-F1393 |
From old datasheet system
GaAs FET (Low noise High gain For low-noise front end amplifiers For DBS down converters)
SCREWDRIVER, MULTI BLADE 7PCSCREWDRIVER, MULTI BLADE 7PC; Kit contents:7 Piece Set X BAND, GaAs, N-CHANNEL, RF SMALL SIGNAL, JFET
|
http://
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
|
| WEDPNF8M721V-1010BC WEDPNF8M721V-1010BI WEDPNF8M72 |
8Mx72 Synchronous DRAM 8Mb Flash Mixed Module Multi-Chip Package
|
White Electronic Designs
ETC[ETC]
|
| AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30
64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22
256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22
1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22
128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
| WEDPNF8M721V-XBX WEDPNF8M721V-1010BC WEDPNF8M721V- |
8Mx72 Synchronous DRAM 8Mb Flash Mixed Module Multi-Chip Package 8Mx72同步DRAM 8MB闪存的混合模块多芯片封装
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
|
| CS201212-5R6K CS201212-4R7K CS201212-R15K CS201212 |
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 5600000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 4700000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 150000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 3300000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 820000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 680000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 180000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 68000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 33000000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns, Inc.
|
| SKY77604 |
Multi-Mode / Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets
|
Skyworks Solutions Inc.
|
| SKY77601 |
Multi-Mode Multi-Band Power Amplifier Module
|
Skyworks Solutions
|
| CYM1841APR-20C CYM1841BPZ-25C CYM1841APY-20C CYM18 |
x32 SRAM Module X32号的SRAM模块
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZMA64 PLASTIC, ZIP-64
|
Cypress Semiconductor, Corp.
Everlight Electronics Co., Ltd.
Pyramid Semiconductor, Corp.
YEONHO Electronics Co., Ltd.
|
|
